Title Sr. Specialist, Mechanical Engineering

Location NY

MUST BE US CITIZEN

Experience in any or all of the following:

• Autodesk AutoCAD and Inventor
• ANSYS CFD Thermal Analysis
• ANSYS FEA Structural Analysis
• Computer-Aided Design (CAD).
• Understanding of Mil-Spec environmental testing procedures
• Familiarity with brazing and welding of hermetic chip-scale packages
• Experience with chip and wire / hybrid and PCB / surface mount manufacturing techniques a plus.

Job Description:

The Mechanical Engineer Lead will be responsible for mechanical design and development as well as thermal and structural analysis tasks.  The role will also include providing manufacturing, qualification test and integration support. This position would also involve preparing, presenting and leading mechanical engineering sections of internal and customer-based design reviews and technical interchanges.  A Mechanical Engineer at this level will have an advanced knowledge of materials that would allow him/her to choose the ideal material for a design based upon thermal and mechanical properties and manufacturability.  The Mechanical Engineer will need to work closely with a project team consisting of Electrical, Manufacturing and Quality Engineering during the design and integration process.

Essential Functions:

• Mechanical conceptualization and design of new products
• Reviews and evaluates designs and drawings executed by others to satisfy product/project requirements, including mechanical tolerance analysis techniques.
• Supports new product development as well as new business opportunities during proposal stage.
• Evaluates new and emerging technologies and supports tooling design needs for both production and engineering departments as required.
• Familiarity with plating specifications
• Familiarity with solders and epoxies used in microelectronics assembly, with particular attention of CTE mismatches.
• Ability to get security clearance

Qualifications:

• Bachelor’s Degree and minimum 6 years of prior relevant experience. Graduate Degree and a minimum of 4 years of prior related experience.

Preferred Additional Skills:

• Experience with high frequency (>1GHz) components and packaging
• Understanding of Mil-Spec environmental testing procedures
• Experience with chip-and-wire hybrid technology and/or SMT PC Board technology
• Familiarity with brazing and welding of hermetic packages
• Familiarity with solders and epoxies used in microelectronics assembly, with particular attention of CTE mismatches.
• Autodesk AutoCAD and Inventor
• ANSYS CFD Thermal Analysis
• ANSYS FEA Structural Analysis
• Computer-Aided Design (CAD).