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Senior RFIC Engineer ( Remote )

Title Senior RFIC Design ( Remote)



Design, analyze, verify, and document RF Front End Modules, including filters, switches, and LNAs. Develop custom integrated circuits, PWBs, & thin film assemblies.

 Design high performance RF products; responsible for projects from start to finish
o Design for low loss, high linearity, EMI/EMC, reliability, and thermal performance by utilizing advanced models or computer simulations
o Design to accomplish cost, size, weight, power and manufacturability objectives
o Interface with third-party ASIC design, fabrication & packaging partners
o Conduct preliminary evaluation of prototype assemblies
 Champion new product thrusts and technologies
o Spearhead internal research and development efforts. This includes the research and development of topologies, physical implementation, concept models as well as identification of all electrical operating parameters and production test requirements. The focus is on wideband, dynamically tunable designs in microwave bands.
o Provide technical leadership
o High self-motivation and organization; willingness to challenge current-state methodologies and thinking
 Support sales and marketing closely in new product definition and development
o Respond to technical support questions pre-sale and post-sale
o Support bid and proposal efforts
o Ability to translate requirements into production-ready hardware
 Develop performance validation methodology and production test/alignment processes


 Experience in RFIC and MMIC design (SOI, GaAs, GaN, CMOS, InGaP, SiGe, etc.)
 Experience in lumped and distributed RF/microwave design, supporting circuitry, evaluation of performance tradeoffs, and analysis at frequencies up to 26 GHz
o Experience with RF & Microwave design tools (Cadence Virtuoso, AWR, ADS, etc.)
o Experience using AWR Microwave Office software or similar
o Solid knowledge of electromagnetic theory including transmission lines, impedance matching, and resonant structures
 Knowledge of microelectronic fabrication and die packaging methods
 3D EM simulation experience (HFSS, CST, Analyst)
 Experience designing highly integrated RF modules (switches, filters, LNAs, LOs, mixers, phase shifters, attenuators, ADCs, etc.)
 Experience with die level assembly and test (engineering & production) is a plus
 Experience working with third-party foundry service providers is a plus
 Experience in design to cost and manufacturability objectives
 Communicate clearly and effectively in verbal and written formats with business development, engineering, manufacturing, management and customers
 Proactive, responsive approach to projects and customer timelines

To perform this job successfully, an individual must be able to perform each essential function satisfactorily. The requirements listed below are representative of the knowledge, skill and/or ability required. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

Education and/or Experience

 Must be a US person (US Citizen or Permanent Resident (Green Card Holder)
 BSEE from an ABET accredited college or university and 10+ years of relevant experience required OR accredited MSEE and 6+ years of relevant experience, or equivalent
 Experience with RF modeling and simulation software highly desired
 Antenna and switching experience are highly desired
 Experience with military environments and specifications highly desired
 Experience developing new technology and processes highly desired


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